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Low-Pass Filter (Stepped-Impedance)

Stepped-impedance microstrip filter for transmitter harmonic suppression.

Low-Pass Filter (Stepped-Impedance) — Photorealistic 3D PCB Hardware Render
NIKOLARF
Insertion Loss
< 0.35 dB in passband (DC to f_cutoff)
Isolation / Return Loss
> 40 dB rejection at 2·f_0 harmonic
Bandwidth
DC up to designated cutoff frequency (e.g. 3.0 GHz)
Power Rating
High (No discrete components; wide microstrip copper sections)

Device Topology & Electromagnetic Behavior

Constructed from alternating sections of very high characteristic impedance (narrow lines acting as series inductors) and very low characteristic impedance (wide lines acting as shunt capacitors). Eliminates 2nd, 3rd, and higher-order harmonics generated by non-linear RF power amplifiers.

ANALYTICAL FORMULATIONS & S-MATRIX MAPPING
Z_H ≥ 100 Ω (L_eq = (Z_H · ell_H) / (v_p)), Z_L ≤ 20 Ω (C_eq = (ell_L) / (Z_L · v_p))
• Stepped-impedance quasi-lumped inductor and capacitor equivalent synthesis.
f_c = (1) / (2π √(L C)) (Cutoff Frequency Point)
• Butterworth or Chebyshev low-pass prototype polynomial mapping.
Recommended Substrate Stackup

Rogers RT/duroid® 5880 (εr = 2.20) for sharpest transition and highest Z_H impedance width ratio.

Nikola RF Fabrication Directives
  • Enforce maximum line-width ratio (Z_H / Z_L > 5:1) for optimal lumped component approximation.
  • Compensate for step-discontinuity parasitic capacitances at impedance transitions.
Full-Lifecycle Engineering Services

Design, 3D EM Simulation & Handoff for Low-Pass Filter (Stepped-Impedance)

We provide turnkey synthesis, multi-frequency full-wave simulation, and fabrication-ready packaging for the Low-Pass Filter (Stepped-Impedance).

1. 3D Full-Wave FEM Modeling

Complete Ansys HFSS 3D CAD modeling with true edge-launch SMA or SMP connectors, via fence stitching, and adaptive mesh refinement down to ΔS < 0.007.

2. Sensitivity & Tolerance Sweeps

Monte Carlo statistical analysis over copper etching tolerances (±15 µm) and substrate permittivity variations to guarantee first-pass high-yield manufacturing.

3. Manufacturing Handoff

Delivery of verified simulation models, parameterized layout geometries, and photolithography-compliant Gerber RS-274X fabrication packages.

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