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Filtering & Frequency Selection•2-Port Resonator

Band-Pass Filter (Coupled-Line / SIW)

High-selectivity bandpass filter with sharp transmission zeros and high Q-factor.

Band-Pass Filter (Coupled-Line / SIW) — Photorealistic 3D PCB Hardware Render
NIKOLARF
Insertion Loss
< 1.2 dB in center passband (Q-dependent)
Isolation / Return Loss
> 45 dB out-of-band rejection with transmission zeros
Bandwidth
1% to 15% fractional bandwidth
Power Rating
High power handling in SIW cavity formats (>200W CW)

Device Topology & Electromagnetic Behavior

Synthesized using parallel-coupled microstrip resonators, hairpin folds, or Substrate Integrated Waveguide (SIW) resonant cavities. Passes only the intended operating spectrum while deeply rejecting out-of-band spurious responses, image frequencies, and transmitter bleed-through.

ANALYTICAL FORMULATIONS & S-MATRIX MAPPING
J_k = √(fracπ w)2 g_k g_k+1, (Z₀e, Z₀o) = Z₀ ≤ft[ 1 ± J_k Z₀ + (J_k Z₀)² right]
• Admittance inverter (J-inverter) coupling matrix for Chebyshev coupled-line cascade.
f₀ = (c) / (2 ell √(varepsilon_eff)) (Half-Wave Resonator Length ell)
• Resonant cavity dimension establishing center passband frequency.
Recommended Substrate Stackup

Rogers RT/duroid® 5880 (Lowest tan δ = 0.0009) to maximize unloaded Q-factor (Q_u > 350).

Nikola RF Fabrication Directives
  • Tight photolithography gap spacing (s down to 75 µm) on end coupling stages.
  • Solid via-fence perimeter spacing (pitch p < 2·d) for SIW waveguide enclosure.
Full-Lifecycle Engineering Services

Design, 3D EM Simulation & Handoff for Band-Pass Filter (Coupled-Line / SIW)

We provide turnkey synthesis, multi-frequency full-wave simulation, and fabrication-ready packaging for the Band-Pass Filter (Coupled-Line / SIW).

1. 3D Full-Wave FEM Modeling

Complete Ansys HFSS 3D CAD modeling with true edge-launch SMA or SMP connectors, via fence stitching, and adaptive mesh refinement down to ΔS < 0.007.

2. Sensitivity & Tolerance Sweeps

Monte Carlo statistical analysis over copper etching tolerances (±15 µm) and substrate permittivity variations to guarantee first-pass high-yield manufacturing.

3. Manufacturing Handoff

Delivery of verified simulation models, parameterized layout geometries, and photolithography-compliant Gerber RS-274X fabrication packages.

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Submit your operational frequency, bandwidth, power handling, and target substrate stackup. Our electromagnetic engineers will deliver a verified feasibility audit within 48 hours.

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Initiate Project Scope & NDA

We treat client intellectual property with military-grade rigor. Prior to receiving proprietary disclosure files, patent drafts, or trade secret geometries, we execute standard bilateral NDAs.

Bilateral NDA Standard

Mutual non-disclosure executed before file transmission.

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Simulations run on dedicated air-gapped workstations.

Clean Room Protocol

Full audit trail for IP litigation and patent defense.

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Computational Electromagnetics • Microwave Co-Design • Strict Engineering Confidentiality