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Impedance Matching & Utility•3-Port Unbalanced/Balanced

Planar Marchand Balun

Converts single-ended coaxial signals to differential balanced feeds with 180° phase split.

Planar Marchand Balun — Photorealistic 3D PCB Hardware Render
NIKOLARF
Insertion Loss
-3.2 dB per balanced arm (0.2 dB excess insertion loss)
Isolation / Return Loss
> 25 dB Common-Mode Rejection Ratio (CMRR)
Bandwidth
> 60% fractional bandwidth (Multi-octave)
Power Rating
Medium to High (Planar microstrip/stripline format)

Device Topology & Electromagnetic Behavior

A planar microwave Marchand balun composed of coupled line sections that transforms an unbalanced 50 Ω input into a balanced 100 Ω differential output pair with exact 180° phase opposition and zero common-mode leakage. Critical for feeding dipole antennas, log-periodic arrays, and double-balanced mixers.

ANALYTICAL FORMULATIONS & S-MATRIX MAPPING
Z_bal = 2 · Z_unbal = 100 Ω (Differential Balanced Output Impedance)
• Transforms 50 Ω ground-referenced line into 100 Ω floating differential pair.
∠ S₂1 - ∠ S₃1 = 180.0° ± 2.0° (Phase Balance Condition)
• Strict anti-phase differential balance over the operating band.
Recommended Substrate Stackup

Rogers RT/duroid® 6010.2LM (εr = 10.2) for tight coupled line spacing and size reduction.

Nikola RF Fabrication Directives
  • Strict symmetry across the longitudinal center axis to minimize amplitude/phase unbalance.
  • Broadside coupled stripline topology for ultra-tight coupling in multi-layer stackups.
Full-Lifecycle Engineering Services

Design, 3D EM Simulation & Handoff for Planar Marchand Balun

We provide turnkey synthesis, multi-frequency full-wave simulation, and fabrication-ready packaging for the Planar Marchand Balun.

1. 3D Full-Wave FEM Modeling

Complete Ansys HFSS 3D CAD modeling with true edge-launch SMA or SMP connectors, via fence stitching, and adaptive mesh refinement down to ΔS < 0.007.

2. Sensitivity & Tolerance Sweeps

Monte Carlo statistical analysis over copper etching tolerances (±15 µm) and substrate permittivity variations to guarantee first-pass high-yield manufacturing.

3. Manufacturing Handoff

Delivery of verified simulation models, parameterized layout geometries, and photolithography-compliant Gerber RS-274X fabrication packages.

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Submit your operational frequency, bandwidth, power handling, and target substrate stackup. Our electromagnetic engineers will deliver a verified feasibility audit within 48 hours.

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Computational Electromagnetics • Microwave Co-Design • Strict Engineering Confidentiality